RN2 Technologies Co. Ltd.

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Density 5.85 g/cc 2.43 g/cc 3.10g/cc 3.05g/cc
K 41.5 5.6 7.8 9.1
Tan d <0.0001 <0.001 0.0015 0.0015
TCE 5.5 ppm/℃ 8.0 ppm/℃ 5.8 ppm/℃ 5.6 ppm/℃
Strength 180 MPa 180 MPa 200 MPa 200 MPa
① Via Diameter ≥ 100
② Cover Pad Diameter ≥ 120
③ Isolation Gap ≥80
④ Line Width ≥100
Layer Count 30 layer max.
Substrate Thickness 0.5~5 mm
Flatness 1 um/mm